|Description:||Thickness of a single wafer, measured at 9 locations for 184 consecutive batches. A single wafer is removed from a tray of wafers (always at the same position for each batch of wafers) after the chemical vapour decomposition process is complete.|
|Data source:||Industrial data (origin unknown). The data have been approximately centered and scaled to disguise the original variables - for confidentiality.
The location of the 9 thicknesses are:
|Data shape:||184 rows and 9 columns|
|Contact person:||Kevin Dunn|
|Added here on:||27 March 2011 20:45|
|Last updated:||08 April 2011 11:52|