OpenMV.net Datasets
Back to all datasetsSilicon wafer thickness
| Description: | Thickness of a single wafer, measured at 9 locations for 184 consecutive batches. A single wafer is removed from a tray of wafers (always at the same position for each batch of wafers) after the chemical vapour decomposition process is complete. |
| Data source: | Industrial data (origin unknown). The data have been approximately centered and scaled to disguise the original variables - for confidentiality.
The location of the 9 thicknesses are:
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| Data shape: | 184 rows and 9 columns |
| Usage restrictions: | None |
| Contact person: | Kevin Dunn |
| Contact details: | kgdunn@gmail.com |
| Added here on: | 27 March 2011 20:45 |
| Last updated: | 11 November 2018 16:35 |
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