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Silicon wafer thickness

Description: Thickness of a single wafer, measured at 9 locations for 184 consecutive batches. A single wafer is removed from a tray of wafers (always at the same position for each batch of wafers) after the chemical vapour decomposition process is complete.
Data source: Industrial data (origin unknown). The data have been approximately centered and scaled to disguise the original variables - for confidentiality.

The location of the 9 thicknesses are: Particles in a foam suspension in a stirred tank

Data shape: 184 rows and 9 columns
Usage restrictions: None
Contact person: Kevin Dunn
Contact details: kgdunn@gmail.com
Added here on: 27 March 2011 20:45
Last updated: 11 November 2018 16:35

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Tags for this dataset

multivariate outliers
(c) Kevin Dunn, learnche.org